25LC128
Hotenda Part Number
H2403357
Manufacturer Part
XA7Z030-1FBG484Q
Manufacturer
Xilinx
Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 484-FCBGA (23x23)
Category
Integrated Circuits (ICs)
Family
System On Chip Embedded
Series
-
Manufacturer Quantity
4381
Datasheets Online
-
Price & Packaging & Delivery

Attention: The price is for reference only , pls send us RFQs for the update price.

Packaging: Regular packing reel, tube, tray, box and etc.

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Datasheets
XA Zynq-7000Overview
PCN Design/Specification
Zynq-7000 AP Requirement 28/Sep/2015
PCN Obsolescence/ EOL
XA7Z030-1FBG484Q/XA7Z030-1FBG484I EOL Notice 7/Dec/2015
Architecture
MCU, FPGA
Category
Integrated Circuits (ICs)
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Family
Embedded - System On Chip (SoC)
MCU Flash
-
MCU RAM
256KB
Manufacturer
Xilinx Inc.
Number of I/O
130
Operating Temperature
-40°C ~ 125°C (TJ)
Package / Case
484-BBGA, FCBGA
Packaging
Tray
Part Status
Obsolete
Peripherals
DMA
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Series
Automotive, AEC-Q100, Zynq®-7000 XA
Speed
667MHz
Supplier Device Package
484-FCBGA (23x23)
Other Names
Q8852560
Standard Package
1

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