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25LC128
Hotenda Part Number
H1921814
Manufacturer Part
BDN18-3CB/A01
Manufacturer
CTS Electronic Components
Description
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Category
Fans, Thermal Management
Family
Heat Sinks for Thermal
Series
-
Manufacturer Quantity
2838
Datasheets Online
-
Price & Packaging & Delivery
Quantity
Unit Price
Ext. Price
1
$3.46
$3.46
10
$0.34
$3.37
25
$0.13
$3.28
50
$0.06
$3.10
100
$0.03
$2.92
250
$0.01
$2.73
500
$0.01
$2.64
1,000
$2.37
$2.37
5,000
$0.46
$2.32

Attention: The price is for reference only , pls send us RFQs for the update price.

Packaging: Regular packing reel, tube, tray, box and etc.

Delivery: Shipping can be arranged ASAP since payment received

Inquiry
  • FedEx, DHL, and UPS can be selected.
  • You can select whether to charge shipping fee by your shipping account or to charge by our side.
  • Please confirm with the logistics company in advance if you are in a remote area. （It may cost extra fees (35-50 USD) for delivery at those areas.）
  • The shopping cart will automatically calculate the shipping cost.
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped. (Package Tracking) （It may take up to 24 hours before carriers display the info.）
  • PayPal, Credit Card, TT in advance (bank transfer), Western Union can be chosen.
  • Cash transfer only. (Transfer with checks and bills are not accepted.)
  • Customer is responsible for paying all possible charges, including sales tax, VAT and customs charges,etc.
  • If you need the detailed invoice or tax ID, please email us.
Datasheets
Various Semiconductor Heat Sink
Online Catalog
BDN Series
RoHS Information
BDN Series RoHS Cert
Attachment Method
Thermal Tape, Adhesive (Included)
Category
Fans, Thermal Management
Diameter
-
Family
Thermal - Heat Sinks
Height Off Base (Height of Fin)
0.355" (9.02mm)
Length
1.81" (45.97mm)
Manufacturer
CTS Thermal Management Products
Material
Aluminum
Material Finish
Black Anodized
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Part Status
Active
Power Dissipation @ Temperature Rise
-
Series
BDN
Shape
Square, Pin Fins
Thermal Resistance @ Forced Air Flow
3.5°C/W @ 400 LFM
Thermal Resistance @ Natural
10.8°C/W
Type
Top Mount
Width
1.810" (45.97mm)
Other Names
294-1104
BDN183CB/A01
Standard Package
300
Tags
BDN18 (2) BDN1 (11) BDN (29)
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