Advanced Photonix, Inc.

Manufactures and designs high performance standard and custom opto devices, x-ray detectors, UV and blue-enhanced high-speed photoconductive, and low-noise photovoltaic silicon PIN photodiodes, phototransistors and opto IC sensors. Configurations include single-element and multi-element arrays, bi-cells, quadrants, position sensors, long-line devices, detector-filter combinations, and detector-amplifier hybrids. 

A complete line of UV, blue-enhanced and NIR solderable chips is available. Single and dual Cadmium Sulfoselenide (CdS) photoconductive, light dependent resistors (photocells) are also manufactured. GaAs (940nm) and GaAlAs (880nm) LPE and VPE, high-power IR emitters are also produced. Custom opto components, subassemblies, opto hybrids, and PCB assemblies can be designed and produced with quick turnaround and minimum NRE cost.

Advanced Photonix, Inc. (ASE: API) is a leading supplier of opto-electronic solutions and Terahertz sensors and instrumentation to a global OEM customer base. Our solutions are based on our patented high speed optical receivers in III-V materials in APD and PIN configurations and silicon Large Area Avalanche Photodiode (LAAPD), PIN photodiode and FILTRODE® detectors. The Terahertz sensor product line is targeted to the Non-Destructive Testing (including Baggage/Cargo Scanning) and Quality Control markets. Our served markets are: Telecom, Homeland Security, Military, Medical, and Industrial/NDT.

Test and Quality Assurance - Extensive in-house testing ensures reliability

API maintains an in-house capability to design and manufacture custom test and data acquisition systems which are integrated with a wide range of environmental, electrical, spectral and reliability tests.

As an ongoing supplier to the high reliability markets of military and aerospace, API performs in-process inspection throughout the wafer fabrication and product assembly processes. Assemblies are tested both pre-cap and at final inspection. This series of testing is designed to meet the most rigorous customer requirements:
High-Speed Auto Probe
Responsivity
Spectral Scans
Spot Scans
Gain-IV
Product Specific
Emitter Array Uniformity

Product Qualification in Accordance with:
MIL-STD-883/750
MIL-PRF-19500
MIL-Q-9858
MIL-I-45208
Telcordia GR-468

Assembly Processes

API’s manufacturing equipment includes multiple wafer dicing saws, epoxy and eutectic die attach, manual and automated wire bonders, automated encapsulation equipment, and hermetic sealing machines. Our manufacturing capabilities are augmented by strategic partnerships with external sources for unique packaging options and optoelectronic technologies.We emphasize a continuous improvement philosophy throughout our workforce and a commitment to capital investments, training and infrastructure development:
Automated and manual die attach
Precision die alignment to .0005 inch (.01mm) and one minute of angle
Automated and manual wire bonding-wedge and ball
SMT and through-hole configurations
Submicron fiber alignment

Assembly Value Added Manufacturing

API’s value-added capabilities help customers to shorten the design cycle, lower overall system cost and simplify sourcing complexity. As a result, we provide many customers with optoelectronic subassemblies that increase functionality and simplify assembly of your final product. From the design process to the production floor, API’s engineering and production teams give you the following value-added packaging advantages:
Integrated hybrid circuits with amplifiers and other signal-conditioned electronics
Custom-integrated optics and lenses
Integrated filters and reticles
Custom connector and leadwires
T-E cooling
Fiber alignment and connectors
Beam alignment electronics